B80C1500G Overview
Key Specifications
Mount Type: Through Hole
Pins: 4
Height: 5.6 mm
Length: 9.86 mm
Key Features
- Ideal for printed circuit boards
- High case dielectric strength
- High surge current capability e4
- Typical IR less than 0.1 μA
- Solder dip 275 °C max. 10 s, per JESD 22-B106
