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Vishay Intertechnology Electronic Components Datasheet

DTO25 Datasheet

Surface Mounted Power Resistor Thick Film Technology

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www.vishay.com
DTO25
Vishay Sfernice
Surface Mounted Power Resistor Thick Film Technology
DESIGN SUPPORT TOOLS AVAILABLE
3D 3D
3D Models
FEATURES
• AEC-Q200 qualified
• 25 W at 25 °C case temperature
• Surface mounted resistor - TO-252 (DPAK) style
package
• Wide resistance range: 0.016 to 700 k
• Non inductive
• Resistor isolated from metal tab
• Solder reflow secure at 270 °C / 10 s, MSL = 1
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
DIMENSIONS in millimeters
8.2
0.8 ± 0.1
2.8
10°
6.35
Footprint recommendation for
solderable contact area:
7.87
1.4 +0.2 /-0
0.8 ± 0.1
0.6 ± 0.1
1.6 ± 0.1
Tolerance unspecified: ± 0.3
1.2
5.08
2.54 2.54
1.65 1.65
Notes
• For the assembly, we recommend the lead (Pb)-free thermal profile as per J-STD-020C
• Power dissipation is 3.2 W at an ambient temperature of 25 °C when mounted on a double sided copper board using FR4 HTG, 70 μm of
copper, 39 mm x 30 mm x 1.6 mm, with thermal vias
• For other information about dissipation, see the Application Note 52027: “Thermal Management on SMD Thick Film Resistors (D2TO20,
D2TO35, DTO25)”
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
SIZE
RESISTANCE
RANGE
RATED POWER
P25 °C
W
LIMITING ELEMENT
VOLTAGE UL
V
TOLERANCE
±%
DTO25 TO-252 (DPAK) 0.016 to 700K
25
500 1, 2, 5, 10
TEMPERATURE
COEFFICIENT
± ppm/°C
150
CRITICAL
RESISTANCE
10K
MECHANICAL SPECIFICATIONS
Mechanical Protection
Molded
Resistive Element
Thick film
Substrate
Alumina
Connections
Tinned copper, Ni under layer
Weight
2 g max.
ENVIRONMENTAL SPECIFICATIONS
Temperature Range
-55 °C to +150 °C
Climatic Category
55 / 150 / 56
Flammability
IEC 60695-11-5
2 applications 30 s
separated by 60 s
ELECTRICAL SPECIFICATIONS
Tolerances
From 0.016 to 0.047 :
± 5 % and ± 10 %
> 0.047 to 0.1 :
± 2 % to ± 10 %
0.11 : ± 1 % to ± 10 %
Power Rating and Thermal
Resistance
Temperature Coefficient
25 W at +25 °C case
temperature RTH (j - c): 5 °C/W
See Special Feature table
± 150 ppm/°C
Dielectric Strength
1500 VRMS - 1 min - 15 mA max.
(between terminals and board)
Insulation Resistance
104 M
Inductance
0.1 μH
Revision: 20-Mar-2019
1 Document Number: 51054
For technical questions, contact: sferfixedresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000


Vishay Intertechnology Electronic Components Datasheet

DTO25 Datasheet

Surface Mounted Power Resistor Thick Film Technology

No Preview Available !

www.vishay.com
DTO25
Vishay Sfernice
DIMENSIONS
Standard Package
TO-252 style (DPAK)
SPECIAL FEATURES
Resistance Values
Requirement Temperature Coefficient (TCR)
(-55 °C +150 °C) IEC 60115-1
0.016
± 900 ppm/°C
0.1
± 350 ppm/°C
0.5
± 150 ppm/°C
PERFORMANCE
TESTS
Momentary Overload
Load Life
High Temperature Exposure
Temperature Cycling
Biased Humidity
Operational Life
ESD Human Body Model
Vibration
Mechanical Shock
Board Flex
Terminal Strength
CONDITIONS
IEC 60115-1 §4.13
1.6 Pr 5 s
US < 1.5 UL
IEC 60115-1
1000 h, 90/30 Pr at +25 °C
AEC-Q200 REV D conditions:
MIL-STD-202 method 108
1000 h, +175 °C, unpowered
AEC-Q200 REV D conditions:
pre-conditioning 3 reflows according
JESTD020D
JESD22 method JA-104
1000 cycles, (-55 °C to +125 °C)
dwell time 15 min
AEC-Q200 REV D conditions:
MIL-STD-202 method 103
1000 h, 85°C, 85 % RH
AEC-Q200 REV D conditions:
pre-conditioning 3 reflows according
JESTD020D
MIL-STD-202 method 108
1000 h, 90/30, powered, +125 °C
AEC-Q200 REV D conditions:
AEC-Q200-002
25 kVAD
AEC-Q200 REV D conditions:
MIL-STD-202 method 204
20 g’s for 20 min, 12 cycles
test from 10 Hz to 2000 Hz
AEC-Q200 REV D conditions:
MIL-STD-202 method 213
100 g’s, 6 ms, 3.75 m/s
3 shocks/direction
AEC-Q200 REV D conditions:
AEC-Q200-005
bending 2 mm, 60 s
AEC-Q200 REV D conditions:
AEC-Q200-006
1.8 kgf, 60 s
REQUIREMENTS
± (0.25 % + 0.005 )
± (1 % + 0.005 )
± (1 % + 0.005 )
± (0.5 % + 0.005 )
± (0.5 % + 0.005 )
± (1 % + 0.005 )
± (0.5 % + 0.005 )
± (0.5 % + 0.005 )
± (0.5 % + 0.005 )
± (0.25 % + 0.01 )
± (0.25 % + 0.01 )
ASSEMBLY SPECIFICATIONS
For the assembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C
TESTS
CONDITIONS
REQUIREMENTS
Resistance to Soldering Heat
AEC-Q200 REV D
MIL-STD-202 method 210
Solder Bath method: 270 °C / 10 s
± (0.5 % + 0.005 )
Moisture Sensitivity Level (MSL)
IPC / JEDEC® J-STD-020C
85 °C / 85 % RH / 168 h
Level: 1
+ pass requirements of TCR
Overload and Dielectic Strength after MSL
Revision: 20-Mar-2019
2 Document Number: 51054
For technical questions, contact: sferfixedresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000


Part Number DTO25
Description Surface Mounted Power Resistor Thick Film Technology
Maker Vishay
Total Page 7 Pages
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