FESF16JT
FEATURES
- Power pack
- Glass passivated pellet chip junction
- Ultrafast recovery time
- Low switching losses, high efficiency
- High forward surge capability
Available
- Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for D2PAK (TO-263AB) package)
- Solder dip 275 °C max. 10 s, per JESD 22-B106 (for TO-220AC and ITO-220AC package)
- AEC-Q101 qualified available
- Automotive ordering code: base P/NHE3(for ITO-220AC) base P/NHM3(for D2PAK (TO-263AB package))
- Material categorization: for definitions of pliance please see .vishay./doc?99912
TYPICAL APPLICATIONS
For use in high frequency rectifier of switching mode power supplies, inverters, freewheeling diodes, DC/DC converters, and other power switching application.
MECHANICAL DATA Case: TO-220AC, ITO-220AC, D2PAK (TO-263AB) Molding pound meets UL 94 V-0 flammability rating Base P/N-E3
- Ro HS-pliant, mercial grade Base P/NHE3_X
- Ro HS-pliant and AEC-Q101 qualified (“_X” denotes revision code e.g. A,...
