MURS140 Key Features
- Glass passivated chip junction
- Ideal for automated placement
- Ultrafast reverse recovery time
- Low switching losses, high efficiency
- High forward surge capability
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- Solder dip 260 °C, 40 s
- ponent in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
