PB5008
Key Features
- UL recognition file number E312394 (QQQX2) UL 1557 (see
- Enhanced high-current density single in-line package
- Superior thermal conductivity
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- Material categorization: For definitions of pliance please see .vishay./doc?99912
