PWA Key Features
- Wire bondable
- 500 mW power
- Chip size: 0.030" x 0.045"
- Case: 0503
- Resistance range 0.3 ī to 1 Mī
- Oxidized silicon substrate for good power
- Resistor material: Tantalum nitride, self-passivating
- Material categorization: for definitions of pliance