S2D Overview
1.0 μA 1.15 V 175 °C Package SMB (DO-214AA) Circuit configuration Single.
S2D Key Features
- Low profile package
- Ideal for automated placement
- Glass passivated pellet chip junction
- Low forward voltage drop
- Low leakage current
- High forward surge capability
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- AEC-Q101 qualified available
- Automotive ordering code: base P/NHE3 or P/NHM3
- Material categorization: for definitions of pliance please see .vishay./doc?99912
