SAC7.0 Key Features
- Glass passivated chip junction
- 500 W peak pulse power capability with a
- Excellent clamping capability
- Very fast response time
- Low incremental surge resistance
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- Material categorization: for definitions of pliance please see .vishay./doc?99912
