SEG10FG Datasheet

Features and Benefits

• Glass passivated pellet chip junction Available
• Low profile package
• Ideal for automated placement
• Low forward voltage drop, low leakage current
• ESD capability
• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
• Wave and reflow solderable
• AEC-Q101 qualified available .