Download SMBJ15 Datasheet PDF
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SMBJ15 Key Features

  • Low profile package
  • Ideal for automated placement
  • Glass passivated chip junction
  • Available in uni-directional and bi-directional
  • 600 W peak pulse power capability with a
  • Excellent clamping capability
  • Very fast response time
  • Low incremental surge resistance
  • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
  • Solder dip 260 °C, 40 s

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SMBJ15 Description

SMBJ5.0 thru SMBJ188CA Vishay General Semiconductor Surface Mount TRANSZORB® Transient Voltage Suppressors DO-214AA (SMB J-Bend) PRIMARY CHARACTERISTICS VWM PPPM IFSM (uni-directional only) TJ max. 5.0 V to 188 V 600 W 100 A 150 °C DEVICES FOR BI-DIRECTION APPLICATIONS For bi-directional devices use C or CA suffix (e.g. apply in both directions.