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T85HFL60 - Fast Recovery Diodes

Download the T85HFL60 datasheet PDF. This datasheet also covers the T85HFL variant, as both devices belong to the same fast recovery diodes family and are provided as variant models within a single manufacturer datasheet.

Description

The series of T-modules uses fast recovery power diodes in a single diode configuration.

The semiconductors are electrically isolated from the metal base, allowing common heatsink and compact assemblies to be built.

Features

  • Fast recovery time characteristics.
  • Electrically isolated base plate.
  • 3500 VRMS isolating voltage.
  • Standard JEDEC package.
  • Simplified mechanical designs, rapid assembly.
  • Large creepage distances.
  • UL E78996 approved.
  • Compliant to RoHS directive 2002/95/EC.
  • Designed and qualified for industrial level.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (T85HFL-Vishay.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number T85HFL60
Manufacturer Vishay
File Size 418.86 KB
Description Fast Recovery Diodes
Datasheet download datasheet T85HFL60 Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
T40HFL, T70HFL, T85HFL Series Vishay Semiconductors Fast Recovery Diodes (T-Modules), 40 A/70 A/85 A D-55 PRODUCT SUMMARY IF(AV) Type 40 A/70 A/85 A Modules - Diode, Fast FEATURES • Fast recovery time characteristics • Electrically isolated base plate • 3500 VRMS isolating voltage • Standard JEDEC package • Simplified mechanical designs, rapid assembly • Large creepage distances • UL E78996 approved • Compliant to RoHS directive 2002/95/EC • Designed and qualified for industrial level DESCRIPTION The series of T-modules uses fast recovery power diodes in a single diode configuration. The semiconductors are electrically isolated from the metal base, allowing common heatsink and compact assemblies to be built.
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