TNPV0805e3 Overview
Imperial size Metric size code TNPV0805 e3 0805 RR2012M TNPV1206 e3 1206 RR3216M TNPV1210 e3 1210 (1) 38 K/W < 1 ppm/V 0.25 W 700 V 155 °C tbd Failure rate: FITobserved ≤ 0.1 x 10-9/h Notes (1) Size not specified in EN 140401-801 (2) Please refer to APPLICATION INFORMATION below (3) Application-specific safety requirements may set limitations to the applicability of the specified voltage APPLICATION INFORMATION The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the reliability of the...
TNPV0805e3 Key Features
- High operating voltage Umax. up to 1000 V
- Low voltage coefficient < 1 ppm/V
- Excellent overall stability at different
- Superior moisture resistivity (85 °C; 85 % RH)
- AEC-Q200 qualified
- Sulfur resistance verified according to ASTM B 809
- Material categorization: for definitions of pliance please see .vishay./doc?99912
TNPV0805e3 Applications
- High operating voltage Umax. up to 1000 V