UGE18DCT
Key Features
- Power pack
- Glass passivated chip junction
- Ultrafast recovery time
- Low switching losses, high efficiency
- Low forward voltage drop
- High forward surge capability
- Solder dip 275 °C max., 10 s per JESD 22-B106
- Material categorization: For definitions of compliance please see www.vishay.com/doc?99912
