Description
The semiconductor in the SOT-227 package is isolated from the copper base plate, allowing for common heatsinks and compact assemblies to be built.
Features
- Hyperfast and soft recovery characteristic.
- Electrically isolated base plate.
- Simplified mechanical designs, rapid assembly.
- High operation junction temperature (TJ max. = 175 °C).
- Designed and qualified for industrial and consumer level.
- UL approved file E78996.
- Material categorization: for definitions of compliance
please see www. vishay. com/doc?99912.
VS-UFH60BA65-Vishay.pdf
