Description
The AAP Gen 7, new generation of ADD-A-PAK module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of interfaces.
Features
- 150 °C TJ operation.
- Low forward voltage drop.
- High frequency operation.
- Low thermal resistance.
- UL approved file E78996.
- Designed and qualified for industrial level.
- Material categorization: for definitions of compliance
please see www. vishay. com/doc?99912.
VS-VSKCS200-045 Datasheet
