BA158GP Overview
Key Specifications
Mount Type: Through Hole
Pins: 2
Max Operating Temp: 175 °C
Min Operating Temp: -65 °C
Key Features
- Superectifier structure for high reliability condition
- Cavity-free glass-passivated junction
- Fast switching for high efficiency
- Low leakage current, typical IR less than 0.1 μA
- High forward surge capability
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- Material categorization: for definitions of compliance please see
