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BYV26EGP - Glass Passivated Ultrafast Rectifier

Features

  • Superectifier structure for high reliability condition.
  • Cavity-free glass-passivated junction.
  • Ultrafast reverse recovery time.
  • Low forward voltage drop.
  • Low switching losses, high efficiency.
  • High forward surge capability.
  • Meets environmental standard MIL-S-19500.
  • Solder dip 275 °C max. 10 s, per JESD 22-B106.
  • AEC-Q101 qualified.
  • Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC.

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Datasheet preview – BYV26EGP

Datasheet Details

Part number BYV26EGP
Manufacturer Vishay Siliconix
File Size 76.57 KB
Description Glass Passivated Ultrafast Rectifier
Datasheet download datasheet BYV26EGP Datasheet
Additional preview pages of the BYV26EGP datasheet.

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Full PDF Text Transcription

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BYV26DGP, BYV26EGP Vishay General Semiconductor Glass Passivated Ultrafast Rectifier SUPERECTIFIER® DO-204AC (DO-15) PRIMARY CHARACTERISTICS IF(AV) 1.0 A VRRM 800 V, 1000 V IFSM 30 A trr 75 ns VF 1.3 V TJ max. 175 °C FEATURES • Superectifier structure for high reliability condition • Cavity-free glass-passivated junction • Ultrafast reverse recovery time • Low forward voltage drop • Low switching losses, high efficiency • High forward surge capability • Meets environmental standard MIL-S-19500 • Solder dip 275 °C max.
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