Recommended Operating Conditions
Parameter
Sym. Min. Typ. Max. Unit
LED Forward
Current for Switch
Turn-on
(TA=–40°C to
+85°C)
IFon
10 —
20 mA
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Absolute Maximum Ratings, TA=25°C
Stresses in excess of the Absolute Maximum Ratings can cause permanent
damage to the device. These are absolute stress ratings only. Functional opera-
tion of the device is not implied at these or any other conditions in excess of
those given in the operational sections of the data sheet. Exposure to maximum
rating conditions for extended periods can adversely affect device reliability.
Ambient Operating Temperature Range, TA .................. –40° to +85°C
Storage Temperature Range, Tstg ................................ –40° to +150°C
Pin Soldering Temperature, t=10 s max, TS ................................ 260°C
Input/Output Isolation Voltage, VISO.....................................3750 VRMS
LED Input Ratings:
Continuous Forward Current, IF...............................................50 mA
Reverse Voltage, IR≤10 µA, VR...................................................10 V
Output Operation:
dc or Peak ac Load Voltage, IL≤1.0 µA, VL ................................15 V
Continuous dc Load Current, IL
Each Pole, Two Poles Operating Simultaneously .................150 mA
Power Dissipation, PDISS..........................................................600 mW
Electrical Characteristics, TA=25°C
Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engi-
neering evaluations. Typical values are for information purposes only and are not part of the testing requirements.
Parameter
LED Forward Current, Switch Turn-on
LED Forward Current, Switch Turn-off
LED Forward Voltage
ON-resistance
Pole-to-pole ON-resistance Matching (S1 to S2)
Output Off-state Bleed-through*
Symbol Min.
IFon —
IFoff 0.2
VF 1.15
RON 2.0
——
——
Output Off-state Leakage
Output Off-state Leakage Pole to Pole
——
——
Output Capacitance Pins 5 to 6, 7 to 8
Pole-to-pole Capacitance (S1 to S2)
—
—
Turn-on Time
Turn-off Time
ton
toff
* Guaranteed by component measurement during wafer probe.
—
—
—
—
—
—
Typ.
2.0
1.8
1.26
3.0
0.2
70
Max.
5.0
—
1.45
5.0
1.0
100
Unit
mA
mA
V
Ω
DΩ
mVpeak
3x10–12 200x10–9 A
20x10–12 1.0x10–6 A
1.0 5.0 µA
2.0 50
µA
20 — pF
20 — pF
50 — pF
0.4 1.0 ms
0.6 1.0 ms
Test Condition
IL=100 mA, t=10 ms
VL=±10 V
IF=10 mA
IF=10 mA, IL=±50 mA
IF=10 mA, IL=±50 mA
f=1.5 MHz square wave
tr/tf=5.0 ns
(See Figure 13.)
IF=0 mA, VL=±5.0 V
VL=±15 V
IF=10 mA
Pins 7, 8 ±3.0 V
Pins 5, 6 Gnd
Pins 7, 8 ±15 V
Pins 5, 6 Gnd
IF=0 mA, VL=0
IF=0 mA, VL=0 V
IF=10 mA, VL=0 V
IF=10 mA, IL=20 mA
IF=10 mA, IL=20 mA
Document Number: 83814
Revision 17-August-01
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