MSP08A011K00F Overview
Key Specifications
Package: SIP
Mount Type: Through Hole
Pins: 8
Height: 4.95 mm
Key Features
- 0.195" [4.95 mm] "A" or 0.350" [8.89 mm] "C" maximum seated height
- Thick film resisitive elements
- Low temperature coefficient (- 55 °C to + 125 °C) ± 100 ppm/°C
- Rugged, molded case construction
- Reduces total assembly costs
- Compatible with automatic insertion equipment and reduces PC board space
- Wide resistance range (10 Ω to 2.2 MΩ)
- Available in tube pack or side-by-side pack
