High temperature metallurgically bonded construction.
Hermetically sealed package.
Cavity-free glass passivated junction.
1.0 ampere operation at Tamb = 55 °C with no thermal runaway.
Fast switching for high efficiency
17031
Mechanical Data
Case: Sintered glass case, JEDEC DO-204AP Terminals: Solder plated axial leads, solderable per MILSTD- 750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 560 mg
Parts Table.
The following content is an automatically extracted verbatim text
from the original manufacturer datasheet and is provided for reference purposes only.
View original datasheet text
www.DataSheet4U.com
VISHAY
RG1A to RG1M
Vishay Semiconductors
Fast Sinterglass Diode
Features
• High temperature metallurgically bonded construction • Hermetically sealed package • Cavity-free glass passivated junction • 1.