S1PB
Overview
- Very low profile - typical height of 1.0 mm Available
- Ideal for automated placement
- Glass passivated pellet chip junction
- Low forward voltage drop
- Low thermal resistance
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- AEC-Q101 qualified
- Material categorization: for definitions of compliance please see
