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Vishay Intertechnology Electronic Components Datasheet

SIC734CD9 Datasheet

Fast Switching MOSFETs

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SiC734CD9
Vishay Siliconix
Fast Switching MOSFETs With Integrated Driver
PRODUCT SUMMARY
Input Voltage Range
Output Voltage Range
Operating Frequency
Continuous Output Current
Peak Efficiency
Optimized Duty Cycle Ratio
3.3 to 24 V
0.5 to 6 V
100 kHz to 1 MHz
Up to 25 A
92.8
10 %
PowerPAK MLF 9 x 9
Bottom View
Ordering Information: SiC734CD9-T1
DESCRIPTION
The SiC734CD9 is an integrated solution which contains two
PWM-optimized MOSFETs (high side and low side MOS-
FETs) and a driver IC. Integrating the driver allows better op-
timization of Power MOSFETs. This minimizes the losses
and provides better performance at higher frequency. The
FUNCTIONAL BLOCK DIAGRAM
FEATURES
• Low-side MOSFET control pin for pre-bias start-up
• Undervoltage Lockout for safe operation
• Internal boostrap diode reduces
component count
• Break-Before-Make operation
• Turn-on/Turn-off Capability
• Compatible with any single or multi-phase PWM
controller
• Low profile, thermally enhanced PowerPAK® MLF 9 x 9
Package
APPLICATIONS
• DC-to-DC Point-of-Load Converters
- 3.3 V, 5 V, or 12 V Intermediate BUS
- Examples
- 12 VIN/0.8 - 2.5 VOUT
- 5 VIN/0.8 - 1.5 VOUT
• Servers and Computers
• Single and Multi-Phase Conversion
www.DataSheet.net/
SiC734CD9 is packed in Vishay Siliconix’s high performance
PowerPAK MLF 9 x 9 package. Compact co-packing of com-
ponents helps to reduce stray inductance, and hence in-
creases efficiency.
VDD
SHDN
PWM
SYNC
CGND
UVLO
+
- BBM
VDD
CBOOT
VIN
SW
PGND
Document Number: 73672
S-62656–Rev. C, 25-Dec-06
Figure 1.
www.vishay.com
1
Datasheet pdf - http://www.DataSheet4U.co.kr/


Vishay Intertechnology Electronic Components Datasheet

SIC734CD9 Datasheet

Fast Switching MOSFETs

No Preview Available !

SiC734CD9
Vishay Siliconix
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
Logic Supply
VDD
Logic Inputs
VPWM
Common Switch Node
VSW
Drain Voltage
VIN
Bootstrap Voltage
CBOOT
Maximum Power Sissipation (Measured at 25 °C )
PD
Operating Juncyion and Storage Temperature Range
Tj, Tstg
Soldering Recommendations (Peak Temperature)a, b
Steady State
7
7.3
30
30
SW + 7
6
- 65 to 125
225
Unit
V
W
°C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is
not implied. Exposure to absolute maximum rating/conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
Parameter
Drain Voltage
Logic Supply
Input Logic PWM Voltage
Bootstrap Capacitor
Symbol
VIN
VDD
VPWM
CBOOT
Steady State
3.3 to 24
4.5 to 5.5
5
100 n to 1 µ
Unit
V
F
THERMAL RESISTANCE RATINGS
Parameterc
Maximum Junction-to-Case
Maximum Junction-to-Ambient
(PCB = Copper 25 mm x 25 mm)
Steady State
Symbol
RthJC
RthJA
www.DataSheet.net/
Typical
3.5
60
Maximum
4.5
75
Unit
°C/W
Notes:
a. See Reliability Manual for profile. The PowerPAK MLF 9 x 9 is a leadless package. The end of the lead terminal is exposed copper (not plated)
as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot guaranteed and is not required to ensure
adequate bottom side soldering interconnection.
b. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
c. Junction-to-case thermal impedance represents the effective thermal impedance of all heat carrying leads in parallel and is intended for use
in conjunction with the thermal impedance of the PC board pads to ambient (RthJA = RthJC + RthPCB-A). It can also be used to estimate chip
temperature if power dissipation and the lead temperature of heat carrying (drain) lead is known.
www.vishay.com
2
Document Number: 73672
S-62656–Rev. C, 25-Dec-06
Datasheet pdf - http://www.DataSheet4U.co.kr/


Part Number SIC734CD9
Description Fast Switching MOSFETs
Maker Vishay Siliconix
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