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UF8CT - (UF8BT - UF8DT) Ultrafast Rectifier

Download the UF8CT datasheet PDF. This datasheet also covers the UF8BT variant, as both devices belong to the same (uf8bt - uf8dt) ultrafast rectifier family and are provided as variant models within a single manufacturer datasheet.

Features

  • Oxide planar chip junction.
  • Ultrafast recovery time.
  • Low switching losses, high efficiency 2 1 U8xT PIN 1 PIN 2 2 UF8xT PIN 1.
  • High forward surge capability.
  • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package).
  • Solder dip 260 °C, 40 s (for TO-220AC and ITO-220AC package).
  • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC 1 CASE PIN 2 TO-263AB K 2 1 UB8xT PIN 1 PIN 2 K.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (UF8BT_VishaySiliconix.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number UF8CT
Manufacturer Vishay
File Size 195.17 KB
Description (UF8BT - UF8DT) Ultrafast Rectifier
Datasheet download datasheet UF8CT Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.DataSheet.co.kr New Product U(F,B)8BT thru U(F,B)8DT Vishay General Semiconductor Ultrafast Rectifier TO-220AC ITO-220AC FEATURES • Oxide planar chip junction • Ultrafast recovery time • Low switching losses, high efficiency 2 1 U8xT PIN 1 PIN 2 2 UF8xT PIN 1 • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C, 40 s (for TO-220AC and ITO-220AC package) • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC 1 CASE PIN 2 TO-263AB K 2 1 UB8xT PIN 1 PIN 2 K HEATSINK TYPICAL APPLICATIONS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer computer, automotive and telecommunication applications.
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