UG06C Key Features
- Glass passivated chip junction
- Ultrafast reverse recovery time
- Soft recovery characteristics
- Low forward voltage drop
- Low switching losses, high efficiency
- High forward surge capability
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- pliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC
