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UG2F - Ultrafast Plastic Rectifier

Features

  • Glass passivated chip junction.
  • Ultrafast reverse recovery time.
  • Low switching losses, high efficiency.
  • High forward surge capability.
  • Solder dip 275 °C max. 10 s, per JESD 22-B106.
  • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC DO-204AC (DO-15).

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Datasheet Details

Part number UG2F
Manufacturer Vishay
File Size 130.09 KB
Description Ultrafast Plastic Rectifier
Datasheet download datasheet UG2F Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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www.DataSheet.co.kr New Product UG2F, UG2G Vishay General Semiconductor Ultrafast Plastic Rectifier FEATURES • Glass passivated chip junction • Ultrafast reverse recovery time • Low switching losses, high efficiency • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC DO-204AC (DO-15) TYPICAL APPLICATIONS PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM trr VF at IF = 2.0 A TJ max. 2.0 A 300 V, 400 V 50 A 35 ns 0.910 V 150 °C For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer and telecommunication.
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