3EZ33D5 Overview
Key Features
- Glass passivated chip
- Built-in strain relief
- Low inductance
- High peak reverse power dissipat
- For use in stabilizing and clipping circuits with high power rating
- Case：Molded plastic,DO-15
- Polarity：As Above Marked
- Terminals :Plated terminals, solderable per MIL-STD-750,Method 2026
- Epoxy : UL94-V0 rated flame retardant
- Mounting position: Any RATINGS AND Rating at 25℃ ambient temperature unless otherwise specif Parameter DC Power Dissipation at TL = 50
