DF08 Overview
Key Features
- Glass Passivated Die Construction
- Low Forward Voltage Drop
- High Current Capability
- High Surge Current Capability
- Designed for Surface Mount Application
- Ideal for Printed Circuit Boards
- Recognized File # E157705
- A ~ + B ~ D J C Mechanical Data E
- Case: DIL, Molded Plastic
- Terminals: Plated Leads Solderable per MIL-STD-202, Method 208 G KH
