SOT1061, NXP
HUSON3
SOT1061
DFN2020-3: plastic thermal enhanced ultra thin small outline
package; no leads; 3 terminals; body 2 x 2 x 0.65 mm
8 February 2016
.
SOT109-1, NXP
PDF: 2003 Mar 24
Philips Semiconductors
Package outline
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A X
c y .
SOT1210, nexperia
SOT1210
Plastic, single ended surface mounted package (LFPAK33); 8
leads; 0.65 mm pitch; 2.7 mm x 3.4 mm x 0.9 mm body
30 January 2017
Package inf.
SOT123F, Diodes
Mechanical Data
• Surface Mount Package • Weight: 0.016grams (Approximate) • Max Soldering Temperature 260°C for 30secs as per JEDEC
J-STD-020 • Polar.
SOT1699-1, NXP
LQFP64
SOT1699-1
LQFP64, plastic, low profile quad flat package; 64 terminals;
0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body
22 November 2019
Package.
