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Weitron Technology

WIMN10 Datasheet Preview

WIMN10 Datasheet

Surface Mount Switching Multi-Chip Diode Array

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Surface Mount Switching Multi-Chip
Diode Array
P b Lead(Pb)-Free
Features:
* Ultra High Speed Switching
* Ultra-Small Surface Mount Package
* For General Purpose Switching Applications
* High Conductance Power Dissipation
Mechanical Data:
* Case : TSOP-6
* Case Material : Molded Plastic. UL Flammability
Classification Ration 94V-0
* Moisture Sensitivity : Level 1 per J-STD-020C
* Terminals : Solderable per MIL-STD-202, Method 208
* Polarity : See Diagram
WIMN10
MULTI-CHIP DIODES
100m AMPERES
80 VOLTS
6
1
TSOP-6
TSOP-6 Outline Dimensions
A
6 54
1 23
BC
D
H
www.DataSheet4U.com
K
J
Ө
L
M
Unit:mm
TSOP-6
Dim Min
A 0.25
B 1.30
C 2.50
D 0.85
Ө
H 2.90
J 0.01
K 0.90
L 0.20
M 0.10
Max
0.50
1.70
3.00
1.05
10°
3.10
0.10
1.10
0.60
0.26
WEITRON
http://www.weitron.com.tw
1/3
04-Mar-09




Weitron Technology

WIMN10 Datasheet Preview

WIMN10 Datasheet

Surface Mount Switching Multi-Chip Diode Array

No Preview Available !

WIMN10
Maximum Ratings @ TA= 25°C unless otherwise specified
Characteristic
Symbol
Peak Reverse Voltage
DC Reverse Voltage
Peak Forward Current
VRM
VR
IFM
Average Recti ed Output Current
Non-Repetitive Peak Forward Surge Current @ t = 1.0s
IO
IFSM
Power Dissipation (Note 1)
Operating Temperature Range
PD
Tj
Storage Temperature Range
TSTG
Note 1 : Not to exceed 200mW per element.
Value
80
80
300
100
4.0
300
+150
-55 to +150
Unit
V
V
mA
mA
A
mW
°C
°C
Electrical Characteristics @ TA = 25°C unless otherwise specified
Characteristic
Symbol
Forward Voltage
IF = 100mA
Reverse Current
VR = 70V
Capacitance between terminals
VR = 6V, f = 1.0MHz
Reverse Recovery Time
VR = 6V, IF =5mA
VF
IR
CT
Trr
Min
-
-
-
-
Max
1.2
0.1
3.5
4.0
Unit
V
µA
pF
ns
Device Marking
Item
www.DataSheWet4IUM.cNom10
Marking
N10
Eqivalent Circuit diagram
16
25
34
WEITRON
http://www.weitron.com.tw
2/3
04-Mar-09


Part Number WIMN10
Description Surface Mount Switching Multi-Chip Diode Array
Maker Weitron Technology
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