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WIMN10 - Surface Mount Switching Multi-Chip Diode Array

Key Features

  • Ultra High Speed Switching.
  • Ultra-Small Surface Mount Package.
  • For General Purpose Switching.

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Datasheet Details

Part number WIMN10
Manufacturer Weitron Technology
File Size 284.61 KB
Description Surface Mount Switching Multi-Chip Diode Array
Datasheet download datasheet WIMN10 Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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WIMN10 Surface Mount Switching Multi-Chip Diode Array P b Lead(Pb)-Free MULTI-CHIP DIODES 100m AMPERES 80 VOLTS Features: * Ultra High Speed Switching * Ultra-Small Surface Mount Package * For General Purpose Switching Applications * High Conductance Power Dissipation 6 1 TSOP-6 Mechanical Data: * Case : TSOP-6 * Case Material : Molded Plastic. UL Flammability Classification Ration 94V-0 * Moisture Sensitivity : Level 1 per J-STD-020C * Terminals : Solderable per MIL-STD-202, Method 208 * Polarity : See Diagram TSOP-6 Outline Dimensions A Unit:mm TSOP-6 6 5 4 B C 1 2 3 D H K Ө L M www.DataSheet4U.com J Dim A B C D Ө H J K L M Min 0.25 1.30 2.50 0.85 0° 2.90 0.01 0.90 0.20 0.10 Max 0.50 1.70 3.00 1.05 10° 3.10 0.10 1.10 0.60 0.26 WEITRON http://www.weitron.com.