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WF1M32B-XXX3 - 1Mx32 3.3V Flash Module

Description

I/O0-31 A0-19 Data Inputs/Outputs Address Inputs Write Enable Chip Selects Output Enable Reset Power Supply Ground Not Connected 23 I/O15 I/O14 I/O13 I/O12 OE# A17 WE# I/O7 I/O6 I/O5 I/O4 33 I/O24 I/O25 I/O26 A7 A12 NC A13 A8 I/O16 I/O17 I/O18 34 VCC CS4# NC I/O27 A4 A5 A6 NC CS3# GND I/O19 44 45

Features

  • Access Times of 100, 120, 150ns.
  • Packaging.
  • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401).
  • 68 lead, Low Profile CQFP (G2T), 4.6mm (0.180") square (Package 509).
  • 1,000,000 Erase/Program Cycles Sector Architecture.
  • One 16KByte, two 8KBytes, one 32KByte, and fifteen 64kBytes in byte mode.
  • Any combination of sectors can be concurrently erased. Also supports full chip erase.
  • Organized as 1Mx32 Commercial, Industr.

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Datasheet Details

Part number WF1M32B-XXX3
Manufacturer White Electronic
File Size 507.82 KB
Description 1Mx32 3.3V Flash Module
Datasheet download datasheet WF1M32B-XXX3 Datasheet

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Full PDF Text Transcription

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www.DataSheet4U.com White Electronic Designs 1Mx32 3.3V Flash Module FEATURES Access Times of 100, 120, 150ns ■ Packaging • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401) • 68 lead, Low Profile CQFP (G2T), 4.6mm (0.180") square (Package 509) ■ ■ 1,000,000 Erase/Program Cycles Sector Architecture • One 16KByte, two 8KBytes, one 32KByte, and fifteen 64kBytes in byte mode • Any combination of sectors can be concurrently erased. Also supports full chip erase ■ ■ ■ Organized as 1Mx32 Commercial, Industrial and Military Temperature Ranges 3.3 Volt for Read and Write Operations ■ ■ ■ ■ ■ ■ ■ WF1M32B-XXX3 Boot Code Sector Architecture (Bottom) Low Power CMOS, 1.
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