W3H64M72E-XSBX package equivalent, 64m x 72 ddr2 sdram 208 pbga multi-chip package.
Data rate = 667*, 533, 400 Package:
* 208 Plastic Ball Grid Array (PBGA), 17 x 23mm
* 1.0mm pitch DDR2 Data Rate = 667*, 533, 400 Core Supply Voltage = 1.8V ± 0.1.
Upgradable to 128M x 72 density (contact factory for information)
* This product is under development, is not qualified o.
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