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W82M32V-XBX - 2M x 32 SRAM 3.3V MULTI-CHIP PACKAGE

Key Features

  • ES.
  • Access Times of 12, 15, 17, 20ns.
  • Packaging.
  • 255 PBGA, 25mm x 25mm, 625mm2.
  • Organized as 2Mx32.
  • Commercial, Industrial and Military Temperature Ranges.
  • Low Voltage Operation:.
  • 3.3V ± 10% Power Supply.
  • Low Power CMOS.
  • TTL Compatible Inputs and Outputs.
  • Fully Static Operation:.
  • No clock or refresh required.
  • Three State Output.
  • Advanced data sheet describes a product that is devel.

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Datasheet Details

Part number W82M32V-XBX
Manufacturer White Electronic Designs
File Size 223.50 KB
Description 2M x 32 SRAM 3.3V MULTI-CHIP PACKAGE
Datasheet download datasheet W82M32V-XBX Datasheet

Full PDF Text Transcription for W82M32V-XBX (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for W82M32V-XBX. For precise diagrams, and layout, please refer to the original PDF.

W82M32V-XBX 2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE ADVANCED* FEATURES „ Access Times of 12, 15, 17, 20ns „ Packaging • 255 PBGA, 25mm x 25mm, 625mm2 „ Organized as 2Mx32 „ Co...

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„ Packaging • 255 PBGA, 25mm x 25mm, 625mm2 „ Organized as 2Mx32 „ Commercial, Industrial and Military Temperature Ranges „ Low Voltage Operation: • 3.3V ± 10% Power Supply „ Low Power CMOS „ TTL Compatible Inputs and Outputs „ Fully Static Operation: • No clock or refresh required. „ Three State Output. * Advanced data sheet describes a product that is developmental, non-qualified and is subject to change or cancellation without notice.

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