W25Q256JW
Table of Contents
1. GENERAL DESCRIPTIONS............................................................................................................. 5
2. FEATURES ....................................................................................................................................... 5
3. PACKAGE TYPES AND PIN CONFIGURATIONS........................................................................... 6
3.1 Pad Configuration 6x5-mm/ 8x6-mm.................................................................................... 6
3.2 Pad Description WSON 6x5-mm/ 8x6-mm .......................................................................... 6
3.3 Pin Configuration SOIC 300-mil ........................................................................................... 7
3.4 Pin Description SOIC 300-mil ............................................................................................... 7
3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8
3.6 Ball Description TFBGA 8x6-mm ......................................................................................... 8
3.7 Ball Configuration WLCSP ................................................................................................... 9
3.8 Ball Description WLCSP....................................................................................................... 9
4. PIN DESCRIPTIONS ...................................................................................................................... 10
4.1 Chip Select (/CS) ................................................................................................................ 10
4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3)................................... 10
4.3 Write Protect (/WP) ............................................................................................................ 10
4.4 HOLD (/HOLD) ................................................................................................................... 10
4.5 Serial Clock (CLK) .............................................................................................................. 10
4.6 Reset (/RESET) .................................................................................................................. 10
5. BLOCK DIAGRAM .......................................................................................................................... 11
6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 12
6.1 SPI Operations ................................................................................................................... 12
6.1.1 Standard SPI Instructions .....................................................................................................12
6.1.2 Dual SPI Instructions ............................................................................................................12
6.1.3 Quad SPI Instructions...........................................................................................................12
6.1.4 3-Byte / 4-Byte Address Modes ............................................................................................13
6.1.5 Software Reset & Hardware /RESET pin..............................................................................13
6.2 Write Protection .................................................................................................................. 14
7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 15
7.1 Status Registers ................................................................................................................. 15
7.1.1 Erase/Write In Progress (BUSY) – Status Only ................................................................15
7.1.2 Write Enable Latch (WEL) – Status Only ..........................................................................15
7.1.3 Block Protect Bits (BP3, BP2, BP1, BP0) – Volatile/Non-Volatile Writable .......................16
7.1.4 Top/Bottom Block Protect (TB) – Volatile/Non-Volatile Writable .......................................16
7.1.5 Complement Protect (CMP) – Volatile/Non-Volatile Writable............................................16
7.1.1 Status Register Protect (SRP, SRL) – Volatile/Non-Volatile Writable ...............................17
7.1.2 Erase/Program Suspend Status (SUS) – Status Only.......................................................18
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