25Q32JVCIM
FEATURES
4 3. PACKAGE TYPES AND PIN CONFIGURATIONS 5
3.1 Pin Configuration SOIC 208-mil 5 3.2 Pad Configuration WSON 6x5-mm, XSON 4x4-mm 5 3.3 Pin Description
SOIC 208-mil, WSON 6x5-mm, XSON 4x4-mm 5 3.4 Pin Configuration SOIC 300-mil 6 3.5 Pin Description
SOIC 300-mil 6 3.1 Ball Configuration TFBGA 8x6-mm (6x4 Ball Array) 7 3.2 Ball...
