25Q32JWBM Datasheet | Winbond

W25Q32JW 1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI Publication Release Date: December 12, 2019 -Revision G W25Q32JW Table of Contents 1. GENERAL DESCRIPTIONS ........................................................................................................ 4 2. Features ................................................................................................................................. 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS ....................................................................... 5 3.1 Pin Configuration SOIC 150-mil / 208-mil ......................................................................... 5 3.2 Pad Configuration WSON 6x5-mm, XSON 4x4-mm, USON4x3-mm ................................. 5 3.3 Pin Description SOIC 150/208-mil, WSON 6x5-mm, XSON 4x4-mm, USON4x3-mm ........ 5 3.4 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ............................................... 6 3.5 Ball Description TFBGA 8x6-mm...................................................................................... 6 3.6 Ball Configuration WLCSP ............................................................................................... 7 3.7 Ball Description WLCSP12............................................................................................... 7 4. PIN DESCRIPTIONS ................................................................................................................... 8 4.1 Chip Select (/CS) ............................................................................................................. 8 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3)................................... 8 4.3 Write Protect (/WP) .......................................................................................................... 8 4.4 HOLD (/HOLD) ................................................................................................................ 8 4.5 Serial Clock (CLK)...