25Q512JVEQ datasheet, memory equivalent, Winbond

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Features and benefits

..... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS..... 6 3.1 Pad Configuration 8x6-mm......... 6 3.2 Pad Description 8x6-mm .. 6 3.3 Pin Configuration SOIC 300-mil . 7 3.4 .

Description

......... 5 2. FEATURES ..... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS..... 6 3.1 Pad Configuration 8x6-mm......... 6 3.2 Pad Description 8x6-mm .. 6 3.3 Pin Configuration SOIC 300-mil . 7 3.4 Pin Description SOIC 300-mil ..... 7 3.5 Ball Configurat.

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