W25N01GVSFIG datasheet, memory equivalent, Winbond

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Features and benefits

.......6 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......7 3.1 Pad Configuration WSON 8x6-mm .........7 3.2 Pad Description WSON 8x6-mm...7 3.3 Pin Configuration SOIC 300-.

Description

..6 2. FEATURES........6 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......7 3.1 Pad Configuration WSON 8x6-mm .........7 3.2 Pad Description WSON 8x6-mm...7 3.3 Pin Configuration SOIC 300-mil ....8 3.4 Pin Description SOIC 300-mil........8 3.5 Ball Con.

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