W25Q16DV
Table of Contents
1. GENERAL DESCRIPTION ............................................................................................................... 5
2. FEATURES ....................................................................................................................................... 5
3. PACKAGE TYPES AND PIN CONFIGURATIONS........................................................................... 6
3.1 Pin Configuration SOIC 150 / 208-mil .................................................................................. 6
3.2 Pad Configuration WSON 6x5-mm / USON 4X3-mm / USON 4X4-mm.............................. 6
3.3 Pin Configuration PDIP 300-mil ............................................................................................ 7
3.4 Pin Description SOIC 150/208-mil, WSON 6x5-mm / USON 4x3-mm / PDIP 300-mil ........ 7
3.5 Ball Configuration WLCSP ................................................................................................... 8
3.6 Ball Description WLCSP....................................................................................................... 8
3.7 Pin Configuration SOIC 300-mil ........................................................................................... 9
3.8 Pin Description SOIC 300-mil ............................................................................................... 9
3.9 Ball Configuration TFBGA 8x6-mm .................................................................................... 10
3.10 Ball Description TFBGA 8x6-mm ....................................................................................... 10
4. PIN DESCRIPTIONS ...................................................................................................................... 11
4.1 Chip Select (/CS) ................................................................................................................ 11
4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3)................................... 11
4.3 Write Protect (/WP) ............................................................................................................ 11
4.4 HOLD (/HOLD) ................................................................................................................... 11
4.5 Serial Clock (CLK) .............................................................................................................. 11
5. BLOCK DIAGRAM .......................................................................................................................... 12
6. FUNCTIONAL DESCRIPTION ....................................................................................................... 13
6.1 SPI OPERATIONS ............................................................................................................. 13
6.1.1 Standard SPI Instructions .....................................................................................................13
6.1.2 Dual SPI Instructions ............................................................................................................13
6.1.3 Quad SPI Instructions...........................................................................................................13
6.1.4 Hold Function .......................................................................................................................13
6.2 WRITE PROTECTION ....................................................................................................... 14
6.2.1 Write Protect Features .........................................................................................................14
7. STATUS REGISTERS AND INSTRUCTIONS ............................................................................... 15
7.1 STATUS REGISTERS........................................................................................................ 15
7.1.1 BUSY Status (BUSY)............................................................................................................15
7.1.2 Write Enable Latch Status (WEL) ........................................................................................15
7.1.3 Block Protect Bits (BP2, BP1, BP0)......................................................................................15
7.1.4 Top/Bottom Block Protect Bit (TB)........................................................................................15
7.1.5 Sector/Block Protect Bit (SEC) .............................................................................................15
7.1.6 Complement Protect Bit (CMP) ............................................................................................16
-2-
