W25Q32FV datasheet, memory equivalent, Winbond

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Features and benefits

.....5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ....6 3.1 Pin Configuration SOIC 208-mil / VSOP 208-mil......6 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm.6 3.3 Pin Descrip.

Description

.........5 2. FEATURES .....5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ....6 3.1 Pin Configuration SOIC 208-mil / VSOP 208-mil......6 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm.6 3.3 Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm ........6.

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