W25Q40EWZPIG datasheet, memory equivalent, Winbond

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..... 5 3. PACKAGE TYPES: ... 6 3.1 Pin Configuration SOIC 150-mil AND VSOP 150-mil ......... 6 3.2 PAD Configuration WSON 6x5-MM / USON 2x3-mm / USON 4x3-mm 6 3.3 Pin D.

Description

......... 5 2. FEATURES ..... 5 3. PACKAGE TYPES: ... 6 3.1 Pin Configuration SOIC 150-mil AND VSOP 150-mil ......... 6 3.2 PAD Configuration WSON 6x5-MM / USON 2x3-mm / USON 4x3-mm 6 3.3 Pin Description SOIC / VSOP 150-mil, WSON 6x5-MM, USON 2x3-mm.

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