Datasheet Details
| Part number | XC2VP4 |
|---|---|
| Manufacturer | Xilinx (now AMD) |
| File Size | 2.24 MB |
| Description | Virtex-II Pro and Virtex-II Pro X Platform FPGAs |
| Datasheet | XC2VP4 XC2VP2 Datasheet (PDF) |
|
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Overview: Product Not Recommended For New Designs 1 R Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Complete Data Sheet DS083 (v5.
This datasheet includes multiple variants, all published together in a single manufacturer document.
| Part number | XC2VP4 |
|---|---|
| Manufacturer | Xilinx (now AMD) |
| File Size | 2.24 MB |
| Description | Virtex-II Pro and Virtex-II Pro X Platform FPGAs |
| Datasheet | XC2VP4 XC2VP2 Datasheet (PDF) |
|
|
|
• Architecture • IP Core and Reference Support • Device/Package Combinations and Maximum I/O • Ordering Information Module 2: Functional Description 60 pages • Functional Description: RocketIO™ X Multi-Gigabit Transceiver • Functional Description: RocketIO Multi-Gigabit Transceiver • Functional Description: Processor Block • Functional Description: PowerPC™ 405 Core • Functional Description: FPGA - Input/Output Blocks (IOBs) - Digitally Controlled Impedance (DCI) - On-Chip Differential Termination - Configurable Logic Blocks (CLBs) - 3-State Buffers - CLB/Slice Configurations - 18-Kb Block SelectRAM™ Resources - 18-Bit x 18-Bit Multipliers - Global Clock Multiplexer Buffers - Digital Clock Manager (DCM) • Routing • Configuration Module 3: DC and Switching Characteristics 59 pages • Electrical Characteristics • Performance Characteristics • Switching Characteristics • Pin-to-Pin Output Parameter Guidelines • Pin-to-Pin Input Parameter Guidelines • DCM Timing Parameters • Source-Synchronous Switching Characteristics Module 4: Pinout Information 302 pages • Pin Definitions • Pinout Tables - FG256/FGG256 Wire-Bond Fine-Pitch BGA Package - FG456/FGG456 Wire-Bond Fine-Pitch BGA Package - FG676/FGG676 Wire-Bond Fine-Pitch BGA Package - FF672 Flip-Chip Fine-Pitch BGA Package - FF896 Flip-Chip Fine-Pitch BGA Package - FF1148 Flip-Chip Fine-Pitch BGA Package - FF1152 Flip-Chip Fine-Pitch BGA Package - FF1517 Flip-Chip Fine-Pitch BGA Package - FF1696 Flip-Chip Fine-Pitch BGA Package - FF1704 Flip-Chip Fine-Pitch BGA Package IMPORTANT NOTE: Page, figure, and table numbers begin at 1 for each module, and each module has its own Revision History at the end.
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| Part Number | Description |
|---|---|
| XC2VP4 | (XC2VPxxx) Platform Flash In-System Programmable Configuration PROMS |
| XC2VP40 | (XC2VPxxx) Platform Flash In-System Programmable Configuration PROMS |
| XC2VP40 | Virtex-II Pro and Virtex-II Pro X Platform FPGAs |
| XC2VP100 | (XC2VPxxx) Platform Flash In-System Programmable Configuration PROMS |
| XC2VP100 | Virtex-II Pro and Virtex-II Pro X Platform FPGAs |
| XC2VP2 | (XC2VPxxx) Platform Flash In-System Programmable Configuration PROMS |
| XC2VP2 | Virtex-II Pro and Virtex-II Pro X Platform FPGAs |
| XC2VP20 | (XC2VPxxx) Platform Flash In-System Programmable Configuration PROMS |
| XC2VP20 | Virtex-II Pro and Virtex-II Pro X Platform FPGAs |
| XC2VP30 | (XC2VPxxx) Platform Flash In-System Programmable Configuration PROMS |