IC264 Datasheet Text
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IC264 Series (Open Top)
Specifications
Ball Grid Array (BGA, 1.50mm Pitch)
Part Number (Details)
1,000MW min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 1 W max. at 10mA/20mV max. Operating Temperature Range:
- 40°C to +150°C 10,000 insertions min. Mating Cycles: 225 contact pins Pin Count: 25g to 35g per individual Contact Force: contact pin
IC264
Series No.
- 225 01
- 1
- -
- - MF
No. of Contact Pins Design Number NN: Without Positioning Pin #1, #2 NP: Without Positioning Pin #1, With Positioning Pin #2 PN: With Positioning Pin #1, Without Positioning Pin #2 Blank: With Positioning Pin #1, #2 MF = Flanged Unmarked = Not Flanged
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel
Outline Socket Dimensions
56.0±0.1 50.0 25.0
4- Æ2.8
(1.5±0.1)x14=21.0±0.15
57.0 37.6±0.1
4-R 3.0
Remended PC Board Layout Matching IC Dimensions IC264-22501-1--
- --
- 56.0±0.05 4- Æ2.8
+0.1 0
13.0±0.1
Top View from Socket
4- Æ2.0 32.5±0.05
+0.1 0...