í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in
Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type
Outline Socket Dimensions
Recommended PC Board Layout
Top View from Socket
2.4
A B±0.05
0.36 -0.1
+0.2
B±0.1
1.8 3.2
H
J±0.2
J±0.1
2.54±0.05
(Contact pos. ) D±0.2
+0.2
C -0.3
E +0.3 0
G
F
2.54±0.1
14.5
2- Æ3.2
1.5 4.0
G±0.1
2- Æ3.2
0.5
3.5.
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
IC37. For precise diagrams, and layout, please refer to the original PDF.
IC37 Series Specifications Dual Inline Package (DIP) Part Number (Details) Insulation Resistance: 1,000M W min. at 500V DC Dielectric Withstanding Voltage: 700V AC for 1 ...
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000M W min. at 500V DC Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 20m W max. at 10mA /20mV max. Current Rating: 1A max. Operating Temperature Range: –40°C to +170°C (PPS) Mating Cycles: 25,000 to 50,000 insertions IC37N Series No. R B - 14 03 - G 4 Housing Material R =PPS Contact Plating: B = Mating Ter. 0.3µm Au Solder Ter. 0.1µm Au Materials and Finish Housing: Polyphenylenesulfide (PPS), glass filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel No.
IC37 Datasheet