* í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline Socket Dimensions Recommended PC Board Layout Top
IC37NRB-1404-G4 Datasheet (57.04 KB)
IC37NRB-1404-G4
Yamaichi Electronics
57.04 KB
Dual inline package.
IC37 Series Specifications Dual Inline Package (DIP) Part Number (Details) Insulation Resistance: 1,000M W min. at 500V DC Dielectric Withstanding V.
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