Download the IC37NRB-2203-G4 datasheet PDF.
This datasheet also covers the IC37 variant, as both devices belong to the same dual inline package family and are provided as variant models within a single manufacturer datasheet.
Key Features
í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in
Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type
Outline Socket Dimensions
Recommended PC Board Layout
Top View from Socket
2.4
A B±0.05
0.36 -0.1
+0.2
B±0.1
1.8 3.2
H
J±0.2
J±0.1
2.54±0.05
(Contact pos. ) D±0.2
+0.2
C -0.3
E +0.3 0
G
F
2.54±0.1
14.5
2- Æ3.2
1.5 4.0
G±0.1
2- Æ3.2
0.5
3.5.
Full PDF Text Transcription for IC37NRB-2203-G4 (Reference)
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
IC37NRB-2203-G4. For precise diagrams, and layout, please refer to the original PDF.
IC37 Series Specifications Dual Inline Package (DIP) Part Number (Details) Insulation Resistance: 1,000M W min. at 500V DC Dielectric Withstanding Voltage: 700V AC for 1 ...
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000M W min. at 500V DC Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 20m W max. at 10mA /20mV max. Current Rating: 1A max. Operating Temperature Range: –40°C to +170°C (PPS) Mating Cycles: 25,000 to 50,000 insertions IC37N Series No. R B - 14 03 - G 4 Housing Material R =PPS Contact Plating: B = Mating Ter. 0.3µm Au Solder Ter. 0.1µm Au Materials and Finish Housing: Polyphenylenesulfide (PPS), glass filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel No.
IC37NRB-2203-G4 Datasheet