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SOT23 - Thermal Resistance and Surface mounted

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Package information - SOT23 Surface mounted, 3 pin package Package outline E e b 3 leads e1 L1 E1 D A A1 L c w w w . D a t a S h e e t . n e t / Dim. A A1 b c D e Millimeters Min. 0.01 0.30 0.085 2.80 Max. 1.12 0.10 0.50 0.20 3.04 - Inches Min. 0.0004 0.012 0.003 0.110 Max. 0.044 0.004 0.020 0.008 0.120 Dim. e1 E E1 L L1 - Millimeters Min. 2.10 1.20 0.25 0.45 Max. 2.64 1.40 0.60 0.62 1.90 NOM Inches Min. 0.083 0.047 0.0098 0.018 Max. 0.104 0.055 0.0236 0.024 0.075 NOM 0.95 NOM 0.037 NOM Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Soldering footprint 0.95 0.037 2.0 0.079 0.9 0.035 0.8 0.031 mm inches Issue 4 - May 2007 © Zetex Semiconductors plc 2007 1 www.zetex.
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