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Package information - SSOP28
Surface mounted, 28 pin package Package outline
D
E1 E
L c
A2 A e A1
b
Dim. A A1 A2 D E E1
Millimeters Min. 1.70 0.05 1.65 9.90 7.40 5.00 Max. 2.00 0.15 1.85 10.50 8.20 5.60
Inches Min. 0.067 0.002 0.065 0.390 0.291 0.197 Max. 0.079 0.006 0.073 0.413 0.323 0.220
Dim. L e b c ⍜ -
Millimeters Min. 0.55 0.22 0.09 0° Max. 0.95 0.38 0.25 8° -
Inches Max. 0.022 0.009 0.004 0° Max. 0.037 0.015 0.010 8° -
0.65 BSC
0.026 BSC
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Soldering footprint
2.261 0.089 9.017 0.355 4.597 0.181
0.432 0.017
0.650 0.0256
mm inches
Issue 1 - September 2005
© Zetex Semiconductors plc 2005
1
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