SMB5373B Datasheet | Chip Integration Technology

Features - Glass passivated chip. - 5.0W Power Dissipation - 3.3V - 220V Nominal Zener Voltage - 5% Standard Vz Tolerance - Low Inductance - Mechanical data - Epoxy:UL94V-0 rated flame retardant - Case : Molded plastic, DO-214AA / SMB - Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 - Polarity : Indicated by cathode band - Weight : 0.093 grams(approx) - Outline SMB(DO-214AA) 0.087 (2.20) 0.071 (1.80) 0.126 (3.20) 0.078 (1.99) 0.063 (1.60) 0.028 (0.70) Marking code 0.191 (4.85) 0.157 (4.00) 0.157 (4.00) 0.130 (3.30) 0.012 (0.31) MAX. 0.220 (5.60) 0.197 (5.00) 0.008 (0.21) MAX. Dimensions in inches and (millimeters) - Maximum ratings and electrical characteristics Rating at 25 OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Parameter DC power dissipation Forward voltage Thermal resistance Conditions TL= 75 OC(1) IF= 1.0A Junction to ambient(2) Junction to lead (1) Storage temperature Operating Junction temperature Note : 1.Mounted on FR-4 PCB with 25.4 x 25.4mm copper pads. 2.Mounted on Ceramic substrate with minimum remended pad layout. Symbol PD VF R θJA R θJL T STG TJ Value 5.0 1.2 90 25 -55 ~ +150 -55 ~ +150 UNIT W V °C/W OC OC Document ID : DS-22Z33 Revised Date :...