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CC2560A Datasheet

Dual-Mode Bluetooth Controller

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CC2560A, CC2560B, CC2564, CC2564B
SWRS121E – JULY 2012 – REVISED JANUARY 2016
CC256x Dual-Mode Bluetooth® Controller
CC2560A NRND; CC2564 NRND
1 Device Overview
1.1 Features
1
• TI's Single-Chip Bluetooth Solution With Bluetooth
Basic Rate (BR), Enhanced Data Rate (EDR), and
Low Energy (LE) Support; Available in Two
Variants:
– Dual-Mode Bluetooth CC2564 Controller
Bluetooth CC2560 Controller
• CC2564 Bluetooth 4.1 Controller Subsystem
Qualified (QDID 58852); Compliant up to the HCI
Layer
• Highly Optimized for Low-Cost Designs:
– Single-Ended 50-Ω RF Interface
– Package Footprint: 76 Terminals, 0.6-mm Pitch,
8-mm x 8-mm mrQFN
• BR/EDR Features Include:
– Up to 7 Active Devices
– Scatternet: Up to 3 Piconets Simultaneously, 1
as Master and 2 as Slaves
– Up to 2 SCO Links on the Same Piconet
– Support for All Voice Air-Coding – Continuously
Variable Slope Delta (CVSD), A-Law, μ-Law,
and Transparent (Uncoded)
– CC2560B/CC2564B Devices Provide an
Assisted Mode for HFP 1.6 Wideband Speech
(WBS) Profile or A2DP Profile to Reduce Host
Processing and Power
– Support of Multiple Bluetooth Profiles With
Enhanced QoS
• LE Features Include:
– Support of Up to 10 (CC2564B) Connections
– Multiple Sniff Instances Tightly Coupled to
Achieve Minimum Power Consumption
– Independent Buffering for LE Allows Large
Numbers of Multiple Connections Without
Affecting BR/EDR Performance.
– Built-In Coexistence and Prioritization Handling
for BR/EDR and LE
• Best-in-Class Bluetooth (RF) Performance
(TX Power, RX Sensitivity, Blocking)
– Class 1 TX Power Up to +10 dBm
– –95 dbm Typical RX Sensitivity
– Internal Temperature Detection and
Compensation to Ensure Minimal Variation in
RF Performance Over Temperature, No
External Calibration Required
– Improved Adaptive Frequency Hopping (AFH)
Algorithm With Minimum Adaptation Time
– Provides Longer Range, Including 2x Range
Over Other LE-Only Solutions
• Advanced Power Management for Extended
Battery Life and Ease of Design
– On-Chip Power Management, Including Direct
Connection to Battery
– Low Power Consumption for Active, Standby,
and Scan Bluetooth Modes
– Shutdown and Sleep Modes to Minimize Power
Consumption
• Physical Interfaces:
– UART Interface With Support for Maximum
Bluetooth Data Rates
• UART Transport Layer (H4) With Maximum
Rate of 4 Mbps
• Three-Wire UART Transport Layer (H5) With
Maximum Rate of 4 Mbps (CC2560B and
CC2564B Only)
– Fully Programmable Digital PCM-I2S Codec
Interface
• Flexibility for Easy Stack Integration and Validation
Into Various Microcontrollers, Such as MSP430™
and ARM® Cortex®-M3 and Cortex®-M4 MCUs
• CC256x Bluetooth Hardware Evaluation Tool: PC-
Based Application to Evaluate RF Performance of
the Device and Configure Service Pack
• Device Pin-to-Pin Compatible With Previous
Devices or Modules
1.2 Applications
• Mobile Accessories
• Sports and Fitness Applications
• Wireless Audio Solutions
• Remote Controls
• Toys
• Test and Measurement
• Industrial: Cable Replacement
• Wireless Sensors
• Automotive Aftermarket
• Point of Service (POS)
• Wellness and Health
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.




etcTI

CC2560A Datasheet Preview

CC2560A Datasheet

Dual-Mode Bluetooth Controller

No Preview Available !

CC2560A NRND; CC2564 NRND
CC2560A, CC2560B, CC2564, CC2564B
SWRS121E – JULY 2012 – REVISED JANUARY 2016
www.ti.com
1.3 Description
The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and
enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device
provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller
unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to
other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software
algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of
operation.
The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI's MSP430 and
ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI's third party. iPod®
(MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode
Bluetooth Stack. Some of the profiles supported include the following:
• Serial port profile (SPP)
• Advanced audio distribution profile (A2DP)
• Audio/video remote control profile (AVRCP)
• Handsfree profile (HFP)
• Human interface device (HID)
• Generic attribute profile (GATT)
• Several Bluetooth LE profiles and services
In addition to software, this solution consists of multiple reference designs with a low BOM cost, including
a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end,
low-power audio solutions.
PART NUMBER
CC2560A (NRND)(2)
Device Information(1)
PACKAGE
RVM (76)
CC2560B
CC2564 (NRND)(2)
RVM (76)
RVM (76)
CC2564B
RVM (76)
(1) For more information on these devices, see Section 9.2, Packaging and Ordering.
(2) NRND = Not recommended for new designs
space
BODY SIZE
8.0 mm × 8.0 mm × 0.6 mm
8.0 mm × 8.0 mm × 0.6 mm
8.0 mm × 8.0 mm × 0.6 mm
8.0 mm × 8.0 mm × 0.6 mm
2
Device Overview
Copyright © 2012–2016, Texas Instruments Incorporated
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Product Folder Links: CC2560A CC2560B CC2564 CC2564B



Part Number CC2560A
Description Dual-Mode Bluetooth Controller
Maker etcTI
Total Page 3 Pages
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