CD40110BE Datasheet | Texas Instruments

Data sheet acquired from Harris Semiconductor SCHS100 PACKAGE OPTION ADDENDUM .ti. 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan (1) Drawing Qty (2) ACTIVE PDIP 25 Ro HS & Green Lead finish/ Ball material (6) NIPDAU MSL Peak Temp Op Temp (°C) (3) N / A for Pkg Type -55 to 125 Device Marking (4/5) (1) The marketing status values are defined as follows: ACTIVE: Product device remended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not remended for new designs. Device is in production to support existing customers, but TI does not remend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Ro HS: TI defines "Ro HS" to mean semiconductor products that are pliant with the current EU Ro HS requirements for all 10 Ro HS substances, including the requirement that Ro HS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "Ro HS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". Ro HS Exempt: TI defines "Ro HS Exempt" to mean products that contain lead but are pliant with EU Ro HS pursuant to a specific EU Ro HS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information,...